5G SG560D Smart Module Series
- Summary
- Specifications
- 5G sub-6GHz LGA smart module
- 42.5 mm × 56.5 mm × 2.95 mm
- Approx. 17.5 g
- LGA package
- Max. downlink 2.5 Gbps / 900 Mbps uplink
- Operating temperature -35 °C to +75 °C
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