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5G SG560D Smart Module Series

  • Summary
  • Specifications
    • 5G sub-6GHz LGA smart module
    • 42.5 mm × 56.5 mm × 2.95 mm
    • Approx. 17.5 g
    • LGA package
    • Max. downlink 2.5 Gbps / 900 Mbps uplink
    • Operating temperature -35 °C to +75 °C

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